cystech electronics corp. spec. no. : c753sa issued date : 2006.07.13 revised date :2013.05.22 page no. : 1/6 sk2xsa cystek product specification 2.0amp. surface mount schottky barrier diodes sk2xsa series features ? for surface mounted applications. ? for use in low voltage, high frequency inverters, free wheeling, and polarity protection applications ? plastic material used carries underwriters laboratory flammability classification 94v-0 ? low leakage current ? high surge capability ? high temperature soldering: 250 c/10 seconds at terminals ? exceeds environmental standards of mil-s-19500/228 mechanical data ? case: sma/do-214ac molded plastic. ? terminals: solder plated, solderable per mil-std-750 method 2026 ? polarity: indicated by cathode band. ? packaging: 12mm tape per eia std rs-481. ? weight: 0.064 gram, 0.002 ounce maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise specified. ) type parameter symbol sk22 sk24 SK26 sk28 sk2b units repetitive peak reverse voltage v rrm 20 40 60 80 100 v maximum rms voltage v rms 14 28 42 56 70 v maximum dc blocking voltage v r 20 40 60 80 100 v maximum instantaneous forward voltage, i f =2a (note 1) v f 0.5 0.5 0.7 0.85 0.85 v average forward rectified current i o 2 a peak forward surge current @8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 80 a maximum dc reverse current v r =v rrm ,t a =25 (note 1) v r =v rrm ,t a =125 (note 1) i r 0.5 20 ma ma maximum thermal resistance, junction to ambient (note 2) r ja 80 maximum thermal resistance, junction to case r jc 32 /w t a =25 c (note 2) 1.3 power dissipation t c =25 c p d 3.1 w diode junction capacitance @ f=1mhz and applied 4v reverse voltage c j 110 (typ) pf storage temperature tstg -55 ~ +150 operating temperature t j -55 ~ +125 notes : 1.pulse test, pulse width=300 sec, 2% duty cycle 2.mounted on pcb with 14mm2 (0.013mm thickness) copper pad area.
cystech electronics corp. spec. no. : c753sa issued date : 2006.07.13 revised date :2013.05.22 page no. : 2/6 sk2xsa cystek product specification characteristic curves SK26 sk22-sk24 sk28-sk2b
cystech electronics corp. spec. no. : c753sa issued date : 2006.07.13 revised date :2013.05.22 page no. : 3/6 sk2xsa cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c753sa issued date : 2006.07.13 revised date :2013.05.22 page no. : 4/6 sk2xsa cystek product specification recommended soldering footprint
cystech electronics corp. spec. no. : c753sa issued date : 2006.07.13 revised date :2013.05.22 page no. : 5/6 sk2xsa cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 265 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 265 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c753sa issued date : 2006.07.13 revised date :2013.05.22 page no. : 6/6 sk2xsa cystek product specification sma/do-214ac dimension marking : device sk22sa sk24sa SK26sa code sk22 sk24 SK26 device sk28sa sk2bsa code sk28 sk2b sma/do-214ac plastic surface mounted package cystek package code : sa *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.055 0.062 1.40 1.60 e 0.006 0.012 0.152 0.305 b 0.098 0.114 2.50 2.90 f 0.002 0.008 0.051 0.203 c 0.157 0.181 4.00 4.60 g 0.030 0.060 0.76 1.52 d 0.078 0.096 2.00 2.44 h 0.188 0.208 4.80 5.28 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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